HPE BladeSystem c7000 Enclosure solution starts with either a BladeSystem c7000 or c3000 enclosure. The HPE BladeSystem c7000 enclosure, key enclosure options include hot-plug power supplies, power input module, hot-plug HPE Active Cool Fans, and an optional redundant BladeSystem Onboard Administrator module.

Each c7000 enclosure is built-in functions:

• Upto 16 half-height server blades, 8 full-height server blades, and/or 8 expansion blades per enclosure (not exceeding 16 total blades).
• Upto 4 redundant interconnect I/O fabrics (Ethernet, Fibre Channel, InfiniBand, iSCSI, SAS, etc.) supported simultaneously within the enclosure.
• HP Thermal Logic technology to minimize power consumption and reduce cooling.
• For additional capacity, redundancy, and improved power consumption and acoustics, Active Cool 200 Fan kits can be added for a maximum of 10 fans.
• Redundant hot-plug cooling, power supplies, connections, interconnect modules, and optional redundant BladeSystem Onboard Administrator management module.

Blade system onboard administrator management

• Robust, multiple enclosure setup, and control.
• Reports asset and inventory information for the devices in the enclosure.
• Reports thermal and power information, including real-time actual power usage per server and per enclosure.
• Front-mounted Insight Display for easy management within the data center.
• Integrated access to all server blades is from a single cable.
• Provides integrated access to interconnect bay device management ports from the single BladeSystem Onboard Administrator cable.
• Single sign-on capability for all devices in the enclosure
• Role-based security locally and/or with LDAP directory services.
• Provides a wizard-based initial setup process for easy configuration

A BladeSystem c7000 enclosure benefits:

• With local and remote hardware management integrated across the solution, one full enclosure can be managed as easily as one server.
• Management and network interconnect extend scalability beyond a single enclosure, allowing resources to be pooled and shared across multiple enclosures.
• Accommodates multiple servers and network designs in one enclosure.
• Lower costs per server in comparison to rack-mounted servers.
• The Lower power consumption in comparison to rack-mounted servers.
• Lower airflow requirements in comparison to rack-mounted servers.
• Reduced and simplified cabling in comparison to rack-mounted servers.
• Investment protection supporting G1 through Gen9 server blades.